How can i cut silicon solar cells?
Question:
Answer:
the term is cleaving. You want to cleave the wafer along a crystal axis. The easiest way to do this is get a very hard clean flat surface. put the wafer/cell/device on this surface. get a very very sharp fine point metal tool. push the very point of the tool down on the very edge of the wafer. Do not saw or shake, just push. Increase presure without shaking your hands and the wafer will crack along a crystal axis. It might not crack along the axis you want and might destroy your device but you will at least know the direction of the axis after youve done it. The key is to push straight down on the very edge of the wafer without vibrating your tool.
Good luck.
You pretty much need a very expensive saw or a laser cutter. You have to know what the crystal direction is and cut along that.
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